Yun-Fong Lee, Chih-Wen Chiu, Chin-Yen Chiu, Yu-Chen Huang, Mei-Hsin Lo, Liu-Hsin-Chen Yang, Ting-Yi Cheng, Zhong-Yen Yu, Chih-En Hsu, Kai-Chi Lin, Po-Yu Chen, Wei-Cheih Huang, Jui-Sheng Chang, Shao-An Pan, Yi-Cheng Su, Chin-Li Lin, Hang-Chen Hsieh, Chia-Hua Lin(林佳樺)*, Cheng-Yi Liu* (2025.08). Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu. Scientific Reports, 15(1), 30978.

Chia-Yueh Chou , Chia-Hua Lin(林佳樺) , Ching-Han Liao , Yen-Ju Wu , Wei-Hao Chen , Bao-Jhen Li , Cheng-Yi Liu (2022.02). Mechanism and quantum efficiency of yellow emission at the organic-inorganic F8T2/p-GaN interface. Surfaces and Interfaces, 29, 101799.

Fan-Ching Chien, Ting Fu Zhang, Chi Chen, Thi Anh Nguyet Nguyen, Song-Yu Wang, Syuan Miao Lai, Chia-Hua Lin(林佳樺), Chun-Kai Huang, Cheng-Yi Liu, and Kun-Yu Lai (2021.04). Nanostructured InGaN Quantum Wells as a Surface-Enhanced Raman Scattering Substrate with Expanded Hot Spots. ACS Applied Nano Materials, 4(3), 2614-2620.

Chia-Yueh Chou, Chia-Hua Lin(林佳樺), Wei-Hao Chen, Bao-Jhen Li, Cheng-Yi Liu (2020.06). High-dielectric-constant silicon nitride thin films fabricated by radio frequency sputtering in Ar and Ar/N2 gas mixture. Thin Solid Films, 709, 138198.

Chia-Hua Lin(林佳樺); Ching-Han Liao; Wei-Hao Chen; Chia-Yuen Chou; Cheng-Yi Liu (2019.04). Fabrication of p-type TiO2 and transparent p-TiO2/n-ITO p-n junctions. AIP advances, 9(4), 045229.